The Findest Sprint

See exactly what your R&D team will walk away with.

A sprint is a focused engagement where your team works with Findest to map, identify, and validate technologies for a specific challenge. In six weeks, you go from an open question to a structured direction backed by evidence.

This page walks you through the scoping phase and the three deliverables your team can generate themselves.

Example sprint

The research question and screens shown here are representative of how a semiconductor sprint runs, not from any actual customer. The challenge we're walking through: "Find cooling technologies that can dissipate > 1 kW/cm² at the die level, including approaches used outside the semiconductor industry." Your sprint will follow the same structure, applied to your own challenge.

The Problem

Your team has a challenge. The answer might sit in an industry you've never looked at.

R&D teams hit the same bottleneck. You know the problem, you don't know what technologies exist to solve it, and the ones you do know come from your own industry. The answer often sits somewhere else entirely.

01

You don't know what's out there

There may be mature technologies in parallel industries that solve your exact problem, often described in terms your team would not think to search for because they fall outside your domain knowledge.

02

One technology alone doesn't help

Finding a single option doesn't tell you if it's the right one. You need a view of the full landscape: what exists, how the options compare, and which ones fit your specific requirements.

03

Validation takes months

Manually reviewing papers, patents, and supplier databases to compare technologies against your KPIs is slow work. By the time you've done it properly, the window has moved.

0Phase Zero

Before the deliverables: scoping the real question

"What is the client actually trying to achieve, and what would the technology need to do to get them there?"

Scoping is where the sprint begins. Findest sits with your team and opens the challenge up, moving from the brief as written to the research plan the sprint will actually run. Customers consistently tell us this conversation is where they get the most unexpected value, because the clarity they walk out with is already a deliverable, even before a single source has been pulled.

In this sprint, the client came in with a narrow version of the question: "Find a better microchannel cold plate for our 3 nm packaging roadmap." Scoping pulled the lens back. The broader aim came out as this: sustain die-level heat flux above 1 kW/cm² without exceeding a 50 °C junction rise, at volumes compatible with a 3 nm production ramp. Same challenge, rephrased to let in any technology that can hit those numbers, not just the ones already on the client's roadmap.

Scoping is also where both sides agree on what's realistic. A sprint runs over six weeks. Your team commits time and domain expertise on one side. Findest commits platform, methodology, and guided support on the other. The scoping conversation names the minimum next step we can both deliver on in that window, and the broader six-week objective we're aiming for.

A

Aim

The underlying goal the technology needs to achieve. Often broader than the original brief.

F

Function

What the technology has to do, described in neutral terms so we can find solutions from adjacent industries.

O

Objectives

Features you want the solution to exhibit. These steer the search toward the right category of answer.

C

Constraints

Hard limits the solution must respect. Verified later when we validate each technology against your requirements.

Function-level language is what lets a sprint pull relevant answers from industries the original brief would never have reached into.

Aim
Sustain die-level heat flux > 1 kW/cm² at ΔT < 50 °C, at 3 nm production volume
Function 1
Dissipate heat internally, at the point where it is generated
Function 2
Reduce the heat buildup inside the die itself
Function 3
Dissipate heat out to the external environment

Each branch became a search that fed Deliverable 1.

Worked Examples

Sprints come in different shapes

The scoping conversation tells us what shape your sprint needs to take. Here are three common ones.

02

One person, one specific problem

A researcher is stuck on a specific problem encountered during experiments and needs a targeted answer. The sprint zooms in on the blocker.

Example: "Which low-k dielectric can survive my current BEOL thermal budget without cracking?" One researcher, one blocker, one set of deliverables focused on that question.

03

One person, broad overview

A researcher wants to understand the full landscape of technologies that could solve a single challenge. One topic, one person, one overview deliverable.

Example: "Give me an overview of every approach that can dissipate heat at the die level in advanced logic."

1Deliverable 1

Technology Landscape

"What technologies exist that can solve my challenge?"

The first deliverable gives your team an overview of the technologies that can meet your requirements. It covers mature options your team already knows about and emerging approaches from adjacent industries that your team may not have looked at before.

The overview is built from peer-reviewed scientific literature and patents. You can trust the source, and every technology in the landscape links back to the original paper or filing. Your team chooses what to read further.

The result is a structured overview, grouped by technology type, with the relevant sources linked to each one.

universe.findest.com / thermal-management-3nm / grouped-results
New search
MS
Maria Santos
Acme R&D
Thermal management 3 nm / Cooling landscape
MS
Cooling landscape
Page · 8 categories · 4,203 sources · Updated 2 days ago
Grouped results
Summary
All sources
Grouped by function
1Microchannel & manifold cold plates812 sources
SEmbedded microchannel cooling of 3D-stacked logic, Tuckerman et al.2024
PSilicon manifold for kilowatt-class heat fluxesUS 2023/0114
2Two-phase immersion & pool boiling645 sources
SDielectric immersion of HPC accelerators at 1.4 kW/cm²2025
WSubmer SmartPod case study, datacentre scale2024
3Jet impingement (single & array)488 sources
SArray jet impingement cooling of GaN-on-SiC RF transistors2023
PAerospace jet array for avionics thermal controlEP 3 812 445
4Vapour chamber & oscillating heat pipes523 sources
SUltra-thin vapour chamber for high-power mobile SoCs2024

Results grouped by technology. Each category contains the relevant papers and patents, organized for reading

What this means for your team: Instead of starting from zero, you start from a complete map. You can see which technology categories exist, how many sources support each one, and which areas are most active in current research.

2Deliverable 2

Technology Deep Dive

"Tell me about this specific technology. How does it work, and what are its key properties?"

You need to know more about a specific technology. You may have already seen the landscape. You may be going straight to a single approach your team already has its eye on. Either path works.

Your team gathers sources on the technology and asks Findest's platform the questions that matter: how does it work, what are its properties, what does performance look like in practice, where has it been applied. The answer is synthesized from peer-reviewed scientific literature, with every claim traceable to the source.

This is the deliverable for when someone on your team needs to know whether the evidence is there, and what it actually says.

universe.findest.com / thermal-management-3nm / quick-answer
New search
MS
Maria Santos
Acme R&D
Thermal management 3 nm / Microchannel / Deep dive
MS
Ask IGOR
How do embedded microchannel cold plates achieve > 1 kW/cm² dissipation in advanced logic?

Embedded microchannel cooling integrates fluidic channels directly into the silicon substrate or within the 3D interconnect stack, placing coolant micrometres from transistor junctions. At channel hydraulic diameters of 50–150 µm, laminar flow in water or dielectric coolant enables convective heat transfer coefficients of 40–120 kW/m²·K1,2.

Working mechanism

Coolant is distributed through a silicon manifold into parallel channels etched into the die backside. Heat passes through ~100 µm of silicon into the channel wall, where forced convection removes the load3.

Demonstrated performance
  • 1.4 kW/cm² sustained dissipation at ΔT = 45 °C2
  • 2.3 kW/cm² peak on GaN-on-SiC test vehicles5
  • Pressure drop below 0.2 bar at 2 L/min2
Sources · 5 cited
1Tuckerman D.B., Park K. · Embedded microchannel cooling of 3D-stacked logicIEEE T-CPMT · 2024
2Nakamura, Chen · Dielectric immersion of HPC accelerators at 1.4 kW/cm²IEEE T-CPMT · 2025
3Silicon manifold designs for kilowatt-class heat fluxesJ. Electronic Packaging · 2024
Save to page
Ask follow-up

Quick Answer: a synthesized overview of technologies with inline [Ref] citations. Every claim traceable to its source

What this means for your team: Your team gets the depth it needs without spending days in the literature. The structured format makes it easy to share findings internally, whether that's in a project review, a decision meeting, or a report to leadership.

3Deliverable 3

Requirements Validation

"Which technology best fits my specific requirements?"

Your team has requirements. Performance thresholds, cost constraints, scalability needs, compatibility criteria. Your team can build a requirements table that compares candidate technologies against those parameters side by side, with the data extracted from scientific literature. Each row is a technology. Each column is a parameter that matters to you. The sources behind every data point are linked, so anyone on your team can verify and dig deeper.

This deliverable is typically where a go / no-go decision gets made: which technologies your team should seriously consider, and which ones can be set aside.

universe.findest.com / thermal-management-3nm / results-table
New search
MS
Maria Santos
Acme R&D
Thermal management 3 nm / Requirements table
MS

Requirements table

5 technologies · 4 parameters · Sources from literature
Filter
Sort
Export
TechnologyMax heat fluxJunction ΔTTRLFit vs. KPI
SEmbedded microchannel
1.4kW/cm²
25
45°C
2
TRL 5
92%
STwo-phase immersion
0.9kW/cm²
7
38°C
7
TRL 7
78%
PArray jet impingement
1.1kW/cm²
11
52°C
11
TRL 4
64%
SVapour chamber
0.4kW/cm²
14
30°C
14
TRL 8
41%
SThermoelectric (on-chip)
0.25kW/cm²
19
20°C
19
TRL 3
28%

Results Table: technologies compared side by side on efficiency, methodology, and key parameters. Each data point linked to its source

What this means for your team: You can make an informed go/no-go decision based on structured evidence. No more gut feel. No more "we think this one is better." The comparison is right there, backed by the literature.

3,000+
Research projects completed across 24 industry verticals
250M
Curated scientific sources, not the open internet
81%
Precision in top 3 results, validated against expert benchmarks
87%
Of teams refer Findest to colleagues or return for another challenge
The Process

How a sprint works

A sprint is a focused, six-week engagement. Your team stays in control of the research direction. Findest provides the tools, the methodology, and the guidance.

Weeks 1–2

Define & Scope

You and Findest align on your challenge, shape the research question, and configure the search parameters. Your domain expertise steers the direction from day one.

Weeks 3–4

Research & Map

Your team runs guided searches across scientific literature and patent databases, using Findest's platform and methodology. Findest walks alongside you, helping you filter, group, and structure the findings into your deliverables.

Weeks 5–6

Validate & Deliver

Your team reviews the findings, asks follow-up questions, and builds the requirements comparison. You walk away with structured deliverables you can act on internally.

After the Sprint

What your team walks away with

The sprint isn't a report that sits on a shelf. It's structured evidence that feeds directly into your decision-making process.

A complete technology map

Every relevant technology, from your industry and adjacent ones, organized by function, with the supporting literature linked.

Deep dives on key technologies

Structured analysis of the technologies that matter most to your challenge, with working mechanisms and key properties extracted from the literature.

A requirements comparison

Technologies compared against your specific KPIs, with every data point traceable to its source document.

Strategic direction

Evidence-backed recommendations on which technologies to pursue, investigate further, or rule out, so your team can make confident go/no-go decisions.

From sprint to platform: Everything your team discovers during the sprint stays in The Universe, Findest's research platform. When new questions arise weeks or months later, your colleagues can pick up where you left off. The research compounds.

chrome-extension / findest-universe
scholar
microchannel cooling 3nm logic
About 24,300 results (0.08 sec)
IN YOUR UNIVERSE
Embedded microchannel cooling of 3D-stacked logic at sub-3 nm nodes
Tuckerman, D. B., Park, K. · IEEE T-CPMT · 2024
… we present an embedded microchannel architecture fabricated in the backside of 3 nm test vehicles, sustaining 1.2 kW/cm² at junction-to-inlet ΔT of 42 °C …
Cited by 147·Related articles·Saved to "Thermal 3nm"
RELATED TO "MICROCHANNEL DEEP DIVE"
Silicon manifold designs for kilowatt-class heat fluxes
Nakamura, H., Chen, L. · Journal of Electronic Packaging · 2024
A comparative study of branching manifold topologies for feeding microchannel arrays, achieving uniform flow distribution across 60 mm² dies at pressure drops below 0.2 bar …
Two-phase flow boiling in silicon microchannels, a review
Kim, S., Mudawar, I. · Int. Journal of Heat & Mass Transfer · 2022
Reviews flow-boiling heat transfer characteristics in silicon microchannels for electronics cooling applications. Critical heat flux correlations …
E!
FINDEST UNIVERSE
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1 source already in your universe saved by Priya · 3 days ago
1 related source matches "Microchannel deep dive"
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Two-phase flow boiling in silicon microchannels, a review
Kim, S., Mudawar, I. · 2022
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P Thermal management 3 nm
P Packaging materials
Save to universe

The Universe browser extension. Research your team has already saved is highlighted as you browse, so nobody duplicates work

Ready to see this for your challenge?

Book a sprint and get structured, evidence-backed direction for your R&D team in six weeks.

Or reach out to your Findest contact to discuss whether a sprint fits your current research priorities.